Jointly appointed in the Department of Electrical and Computer Engineering

Research Interests

• Electronic packaging and electronic materials
• Packaging of power semiconductor devices and modules
• Material synthesis for die bonding, electrical insulation, and magnetic components
• Reliability of power semiconductor packages

Honors and Awards

• Topic Chair, International Conference on Integrated Power Electronics Systems (CIPS) (2020-22)
• Technical Program Chair/Co-Chair, International Symposium on 3D Power
• Electronics Integration and Manufacturing (3D-PEIM) (2016, 2018, 2021)
• Outstanding Technical Paper Award, IEEE ICEP-IAAC Conference (2019)
• 1st Place Paper Award, IEEE IAS Industrial Power Conversion Systems (2019)
• IEEE Fellow (2018)
• 3rd Place Paper Award (W. Portnoy Award), IEEE IAS Industrial Power Conversion Systems (2017); D 100 Award (2017)
• National Science Foundation Faculty Early Career Development (CAREER) Award (1995-99)
• Virginia Tech Sporn Award for teaching (1995)
• Technical Program Chair, the International Workshop on Integrated Power Packaging (IWIPP) (2000)
• ALCOA Foundation Scholarship (1979–84)

Professional Activities

• Organizer/co-organizer workshops/symposia/sessions: CIPS, ICEP, 3D-PEIM, ECCE, APEC, IMAPS
• Associate Editor, ASME Journal of Electronic Packaging (2004-12)
• Guest Editor, IEEE Trans. CPMT: CPT (2001-03); Materials (2019)
• Faculty advisor to Virginia Tech IMAPS Student Chapter since 2000

Education

• 1990: Ph.D., applied physics/materials science, Harvard University
• 1989: M.S., applied physics/materials science, Harvard University
• 1984: Bachelor’s degrees in materials science and engineering and physics, Carnegie Mellon University

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