Dr. Guo-Quan Lu Publications
- H. Zheng, D. Berry, K. D. Ngo, and G.-Q. Lu, "Chip-Bonding on Copper by Pressureless Sintering of Nanosilver Paste Under Controlled Atmosphere," IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 4, pp. 377-384, 2014.
- Y. Yao, G.-Q. Lu, D. Boroyevich, and K. D. Ngo, "Effect of Al2O3 Fibers on the High-Temperature Stability of Silicone Elastomer," Polymer, 2014.
- Y. Yao, Z. Chen, G. Q. Lu, D. Boroyevich, and K. D. Ngo, "Dielectric strength of Al2O3/silicone composites after high-temperature aging,"Journal of Applied Polymer Science, 2014.
- K. Xiao, K. D. Ngo, and G.-Q. Lu, "A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line," Journal of Materials Research, vol. 29, pp. 1006-1017, 2014.
- Y. Mei, J. Lian, X. Chen, G. Chen, X. Li, and G. Lu, "Thermo-Mechanical Reliability of Double-Sided IGBT Assembly Bonded by Sintered Nanosilver," 2014.
- G. Lu, W. Li, Y. Mei, G. Chen, X. Li, and X. Chen, "Characterizations of nanosilver joints by rapid sintering at low temperature for power electronic packaging," 2014.
- S. Fu, Y. Mei, G.-Q. Lu, X. Li, G. Chen, and X. Chen, "Pressureless sintering of nanosilver paste at low temperature to join large area (100mm2 )power chips for electronic packaging," Materials Letters, vol. 128, pp. 42-45, 2014.
- G. Chen, L. Yu, Y.-H. Mei, X. Li, X. Chen, and G.-Q. Lu, "Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging," Journal of Materials Processing Technology, vol. 214, pp. 1900-1908, 2014.
- G. Chen, L. Yu, Y. Mei, X. Li, X. Chen, and G.-Q. Lu, "Uniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging," Materials Science and Engineering: A, vol. 591, pp. 121-129, 2014.
- J. N. Calata, G.-Q. Lu, K. Ngo, and L. Nguyen, "Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature," Journal of Electronic Materials, vol. 43, pp. 109-116, 2014.
- J. N. Calata, G.-Q. Lu, and K. Ngo, "Soft Magnetic AlloyPolymer Composite for High-Frequency Power Electronics Application," Journal of Electronic Materials, vol. 43, pp. 126-131, 2014.
- H. Zhang, H. Jing, Y. Han, L. Xu, and G. Lu, "Interfacial reaction between n-and p-type thermoelectric materials and SAC305 solders," Journal of Alloys and Compounds, vol. 576, pp. 424-431, 2013.
- Y. Yan, Y. Guan, X. Chen, and G.-Q. Lu, "Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode," Journal of Electronic Packaging, vol. 135, p. 041003, 2013.